Engineering Technician, Assembly Lab: Tessera

Engineering Technician, Assembly Lab

You will work closely with Tessera’s advanced semiconductor packaging engineers developing assembly processes for our new µPILR Flip Chip technology.

Job Duties and Responsibilities Include:

· Operating process equipment related to semiconductor package assembly

· Performing assembly quality inspections and tests

· Collecting, organizing and reviewing assembly data with your engineers

· Following assembly lot build plans and process materials preparation

· Supporting the engineering team to quickly understand and resolve process issues

Desired Experience For The Position:

· 2 years assembly experience, preferably related to high bump count flip-chip assembly, or extensive hands-on college lab work

· Process equipment skills: Encapsulation or Underfill Material Dispensing, Die Placement and Attach, Solder Reflow

· Analysis equipment skills: C-SAM, X-ray, Microscope inspection

· Excellent communication and coordination skills

· Proficient in use of MS Office tools such as Word and Excel

Temporary Position, 3-6 months