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Wafer Fabrication & PCB Packaging Development Manager: Diedre Moire Corp.
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Seeking Ph.D. in Mechanical Engineering, Physics, Materials Science, or related discipline with at least 10 years direct experience in the microelectronics industry who has broad understanding of advanced packaging methodologies and is familiar wafer fabrication techniques.
WE ARE AN EQUAL OPPORTUNITY EMPLOYER and our employment decisions are made without regard to race, color, religion, age, sex, national origin, handicap, disability or marital status. We reasonably accommodate individuals with handicaps, disabilities and bona fide religious beliefs. Jobs Career Position Hiring. We will make every effort to consider applications for all available positions and shall use one or more of the contact methods and addresses indicated in resume or online application. Indicated location may be proximate or may be desirable point of embarkation for paid relocation to another venue. CONSIDERED EXPERIENCE INCLUDES: Engineering If you submit an application or resume, which contains your email address, we will use that email address to communicate with you about this and other positions. We use an email quality control service to maintain security and a remove and dead address filter. To cancel receiving email communications, simply send an email from your address with the word "remove" in the subject line to pleaseremove@candseek4.com If you have further concern regarding email received from us, call (609) 584-5499. We will be glad to have a real human being contact you upon request.     |
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