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Equipment Engineer: Headway Technologies, Inc.

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Job ID08-007
Company NameHeadway Technologies, Inc.
Job CategoryEngineering/Architecture; Manufacturing/Operations
LocationMilpitas, CA
Position TypeFull-Time, Employee
Experience15+ Years Experience
Date PostedMarch 25, 2008 (Reposted Jun 13)
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This position is for our subsidiary company Magic Technologies, Inc. located at 463 South Milpitas Blvd., Milpitas, CA 95035 .

General Summary

This position will be responsible for the evaluation, selection, order installation, modification, upgrade and maintenance of manufacturing equipment under the direction of the Equipment Engineering Supervisor.

Principle Duties and Responsibilities

  • Data collection, charting, and analyses of information for equipment.
  • Oversee and manage the installation, modification, upgrade and maintenance of manufacturing equipment.
  • Keep current on equipment manufacturer’s technical notices, upgrades and safety issues.
  • Study equipment performance and reliability.
  • Develop production tool recovery planning during emergency tool down situations.
  • Schedule and manage equipment and manufacturing and improvement projects.
  • Provide technical support to equipment maintenance and other manufacturing organizations.
  • Define preventive maintenance procedures and schedules.
  • Serve as the principle contact for equipment vendors and services.

Job Specification and Requirements*

  • Basic knowledge of chemistry and plasma physics.
  • Advanced knowledge of thin films deposition such as RF Diode, RF Mag, DC Mag, PECVD, RIE, ICP, etc.
  • Basic understanding of digital and analog electronics, fluid dynamics, thermo dynamics, and photolithography.
  • Knowledge of MS Window software (Excel), CAD or similar software knowledge.
  • Knowledge of CMP and wafer polish helpful.
  • Excellent written and oral communication.
  • Must be able to interact well with interdepartmental engineering, internal support organizations and vendors.
  • Focus on quality and service when dealing with suppliers of equipment parts and material.
  • Ability to multitask projects and handle responsibilities that will affect the productivity and utilization of his/her equipment tool set with emphasis on material costs, quality and service from provider.
  • Must be able to make determinations/decisions on critical equipment situations, with consideration to all data, study, experience, etc.
  • Requires occasional travel to perform source acceptance at OEM site or perform technology transfer.
  • Preferably 15+ years as an equipment engineer or similar field.
  • Minimum AA or equivalent, BS preferred or equivalent semiconductor wafer fab maintenance experience and/or military electronics training.

Work Schedule, Conditions and Physical Requirements

Work schedule is from Monday through Friday. Regular work schedule may periodically be adjusted to meet company needs. Majority of the time for this position will be in an office/cube environment. A significant amount of time will be in the wafer fab requiring adherence to the safety and dress standard, including but not limited to bunnysuits, safety shoes, glasses, latex gloves, etc. Physical requirements include manual dexterity, lifting, bending, reaching and standing to work on equipment. Occasional lifting of up to 50 lbs may be required. Some areas will have high noise levels. Contact with hazardous chemicals, fumes or airborne particles may occur. Certain aspects of this job require the use of a respirator, therefore; individuals must shave facial hair in accordance with OSHA requirements and must pass a physical exam that certifies that they are physically fit to wear a respirator.

* Related duties as required are duties that may not be specifically listed in the classification specification or position description.

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