Director of Silicon Engineering: Canesta

Director of Silicon Engineering

Primary Job Responsibilities:

DESIGN AND DEVELOPMENT -

· Responsible for all aspects of chip product development at Canesta.

· Develop responses to MRD’s & RFQ’s in the areas of chip architecture & specification, die size, schedule, power consumption, and performance

· Define roadmap for and manage customization of core Canesta 3D Pixel technology to meet roadmap needs

· Work with various functional teams in Silicon Engineering and other engineering teams to architect and specify 3D sensor implementations meeting market requirements for cost, performance, size, and power consumption.

· Establish chip design flow and methodology to ensure optimal progress of analog and digital teams towards meeting market driven schedules and specifications

· Work with the Operations group and/or directly with manufacturing partners on DFM/DFT to ensure a smooth ramp to high volume product delivery

· Coordinate each functional team in Silicon Engineering to identify and mitigate risks to schedule and market requirements

· Provide leadership and management of the Silicon Engineering department. Build a world class team to cover all requirements and meet the goals set out by.

Minimum Job Requirements:

· Bachelor Degree in Electrical Engineering, Masters Degree in related field preferred

· 15+ years product/technology development experience including at least 7 years of direct individual contributor/hands-on mixed signal circuit design.

· Has led mixed signal chip development to full production including specification & architecture, design, verification, physical design, post silicon validation and qualification

· Strong chip integration experience including A/D design, PLL/DLL/clocking strategies, and external IP acquisition and integration

· In-depth knowledge of developing mixed signal ASIC flows, specifying & successfully deploying CAD solutions to support them

· Demonstrated ability to work effectively in a fast-paced, team oriented, cross-functional and highly dynamic environment, and to meet customer commitments and program deadlines

· Demonstrated ability to recognize problems and develop workable solutions with commitment to follow through to final resolution

· Proven track record of championing new product development leading to products marketed in the US and abroad

Additional Desired Experience:

· Managed development of a CMOS image sensor, especially where significant architectural changes were undertaken

· Managed an SoC development, where significant digital functionality (including an embedded controller) were integrated with a significant analog subsystem

· Managed a low power mixed signal IC development targeted into the mobile or Netbook space