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Packaging Manager: Advanced Communication Solutions, Inc.

Job IDTM16761
Company NameAdvanced Communication Solutions, Inc.
Job CategoryTechnology
LocationSunnyvale, CA
Position TypeFull-Time, Employee
Experience10-15 Years Experience
Date PostedFebruary 29, 2008 (Reposted Apr 7)
Advanced Communication Solutions, Inc.
View Advanced Communication Solutions, Inc. profile and job listings
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Responsibilities:

  • Design & develop high performance packages in wire bond as well as flip chip domain
  • Interface with offshore assembly locations’ staff
  • Process support/troubleshoot
  • Manage package material selection, as well as thermal and electrical characterization
  • Provide technical support to Design Engineers, and Business Managers for product-package definition and cost analysis
  • Interface with QA, Assembly subcontractors, Test, Production Control, and customers to resolve technical issues
  • Drive cost reduction/second source programs
  • New Product design and package development.

Requirements:

  • BS/MS in ME/Material Science plus 10 - 15 yrs experience
  • Strong knowledge of IC Packaging materials, processes, and assembly design rules
  • Excellent analytical, verbal, and communication skills
  • Knowledge of SPC, Package characterization techniques, and DOE methodology
  • Good knowledge of office software and AUTOCAD preferred.

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